Application Engineering Director

Diamond Foundry Inc. is solving the thermal limitation at the foundation of today's most exciting tech industries -- AI & cloud compute, electric-car power electronics, and 5G/6G wireless. We have managed to produce the world's first single-crystal diamond wafers and are now on a mission to put a diamond behind every chip. We are the rare unicorn that has grown fast and profitably. We received $515m in funding and are executing a multi-$B expansion plan for one of the greenest forms of tech manufacturing: converting greenhouse gas into diamond wafers using zero-emission energy. Diamond Foundry is revolutionizing industries with single-crystal diamond, the ultimate material for advanced electronics and thermal management. As the world's leading producer of lab-grown diamond, we are expanding our application engineering team to support our growing customer base in the semiconductor industry. We seek a highly motivated and experienced Application Engineering Manager to drive the adoption of our cutting-edge diamond solutions in advanced packaging and thermal applications. Diamond Foundry believes in supporting our employees from the workplace to their personal and home life. We provide eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work. Perks include employee discounts to VRAI. Our benefits begin as early as your first day of employment. Medical and vision coverage are retroactive to your start date, while dental and voluntary benefits take effect once you’ve completed your enrollment. Diamond Foundry is an Equal Opportunity Employer and considers qualified applicants for employment without regard to race, color, creed, religion, national origin, sex, sexual orientation, gender identity and expression, age, disability, veteran status, or any other protected factor under federal, state or local law. Diamond Foundry Inc. is committed to operating in full compliance with all applicable state and federal laws. Our commitment extends to ensuring that our manufacturing and engineering departments adhere to the highest standards of legal and regulatory compliance. Additionally, these departments may have specific physical requirements to ensure the safety and efficiency of our operations. We prioritize the well-being of our employees and strive to create a work environment that promotes both legal compliance and the optimal functioning of our manufacturing and engineering processes. Manufacturing and Engineering Departments Physical Requirements: -Use appropriate PPE and follow all safety policies, practices, and procedures. -This position will often: Sit, stand for long periods, walk, grasp, reach with hands and arms, lift below and above shoulders, bend, twist at the waist,  climb, balance, stoop, squat,  kneel, crawl, talk, hear, see, use fine finger manipulation, and complete repetitive motions. -Some tasks may require the use of ladders or stairs -Some tasks may require driving or the use of foot controls -Lift/carry and push/pull up to 50 pound This employer participates in E-Verify and will provide the federal government with your Form I-9 information to confirm that you are authorized to work in the U.S. If E-Verify cannot confirm that you are authorized to work, this employer is required to give you written instructions and an opportunity to contact Department of Homeland Security (DHS) or Social Security Administration (SSA) so you can begin to resolve the issue before the employer can take any action against you, including terminating your employment. Employers can only use E-Verify once you have accepted a job offer and completed the Form I-9. Responsibilities Lead and grow the application engineering function focused on semiconductor packaging and thermal management applications. Drive the technical development, execution, and optimization of diamond-based solutions for advanced packaging and thermal management interfaces, integrating state-of-the-art material solutions and processes. Provide in-depth technical expertise on thermal management principles and material characterization. Collaborate with the R&D and product development teams to define product roadmaps, identify new application opportunities, and drive product improvements. Requirements Bachelor's or Master's degree in Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related field with a minimum of 8+ years of experience in semiconductor packaging and/or thermal management applications. Deep understanding of semiconductor packaging technologies, thermal management principles, and material characterization techniques, including advanced packaging basic understanding, including 2.5D/3D IC thermal solutions. Demonstration of exceptional ability and accomplishments, including hands-on development, integration, troubleshooting, and implementation of solutions. Ability to execute from concepts and R&D to scaling and mass production. Strong knowledge of the semiconductor industry, systems engineering, reliability and compliance demonstration, and technology transfers, particularly in advanced packaging and thermal management. Proven ability to lead and manage cross-functional engineering teams, coupled with excellent communication, presentation, and interpersonal skills to support both internal collaboration and external business development and customer engagement. Experience with high thermal conductivity materials and advanced packaging.